White Nitrile Gloves – 12″, Silicone-Free, Powder-Free, for Semiconductor Use

• 12″ Long Cuff
• Silicone-Free
• Powder-Free
• No Fingerprint Residue
• Cleanroom Processed
• OEM / Vacuum Packaging
• Sizes: S–XL
• MOQ: 200 Cartons

Description

Ultra-Clean Gloves for Semiconductor Manufacturing

These 12-inch white nitrile gloves are specially engineered for semiconductor and microelectronics applications where purity, precision, and static control are critical. Designed to be powder-free, silicone-free, and fingerprint-free, they prevent contamination of wafers, optics, and high-sensitivity components.

Each glove undergoes ultra-pure water rinsing, low-residue surface treatment, and is produced in a certified Class 100 cleanroom to ensure minimal NVR, particles, and ionic contamination. Ideal for wafer fabrication, clean packaging, and photolithography processes.

Key Features

  • Silicone-Free & Fingerprint-Free
    No risk of silicone outgassing or print residue—perfect for wafer and optical surfaces.

  • Powder-Free & Latex-Free
    Eliminates airborne particles and skin irritation risks.

  • Cleanroom Processed (Class 100)
    Rinsed with 18MΩ ultra-pure water and vacuum double-packed.

  • Extended 12-Inch Cuff
    Forearm coverage for splash control in contamination-critical areas.

  • Certified Quality
    Full traceability, ISO-compliant production, and test reports available.

Technical Specifications

Specification Details
Material Nitrile (Latex-Free, Silicone-Free)
Color White
Length 12 inches (300 mm)
Surface Texture Smooth, Low-Residue
Thickness 4.5 mil (nominal)
Powder Powder-Free
Fingerprint Transfer None (Tested)
Sizes Available S, M, L, XL
Packaging 100 pcs/double-bagged, vacuum sealed, 10 bags/carton
MOQ 200 cartons
Certifications ISO 9001, RoHS, CE, FDA (upon request)

Testing & Compliance Report Summary

All gloves are tested in certified environments with documented results:

Test Item Result Standard / Method
Non-Volatile Residue (NVR) ≤ 0.50 mg/g IEST-RP-CC005.4
Particles (≥0.5μm/glove) ≤ 1200 pcs IEST-RP-CC005.4 (Dry APC)
Ionic Contamination ≤ 0.20 μg/cm² (Cl⁻, Na⁺, etc.) Ion Chromatography (IC)
Silicone Detection Not Detected (<10 ppb) GC-MS / FTIR
Fingerprint Residue None Visible (Optical Wafer Test) Internal Clean Glass Protocol
Powder Residue None Detected Gravimetric Method
Tensile Strength ≥ 14 MPa ASTM D412
Puncture Resistance ≥ 6 N EN 455-2

✔ Full batch traceability available
✔ Reports can be printed on inner packaging (for OEM clients)

Applications

  • Semiconductor wafer handling

  • Cleanroom photolithography

  • Precision optics & sensors

  • Packaging of sensitive electronics

  • PCB and IC production lines

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